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Agilent HSDL-3200 IrDA(R) Data 1.4 Compliant 115.2 Kb/s Infrared Transceiver
Data Sheet
Features * Fully compliant to IrDA data 1.4 low power specifications * Ultra small package * Minimal height: 2.5 mm * 2.7 to 3.6 VCC * Low shutdown current - 10 nA Typical * Complete shutdown - TXD, RXD, PIN diode * Three external components * Temperature performance guaranteed, -25C to +85C * 25 mA LED drive current * Integrated EMI shield * IEC825-1 Class 1 eye safe * Edge detection input - Prevents the LED from long turn-on time * Lead-free and RoHS compliant Applications * Mobile telecom - Cellular phones - Pagers - Smart phones * Data communication - PDAs - Portable printers * Digital imaging - Digital cameras - Photo-imaging printers * Electronic wallet HSDL-3200#021 Pinout
RIX PULSE SHAPER
Description
The HSDL-3200 is a new generation of low-cost Infrared (IR) transceiver module from Agilent Technologies. It features the smallest footprint in the industry at 2.5 H x 8.0 W x 3.0 D mm. The supply voltage can range from 2.7 V to 3.6 V. The
LED drive current of 25 mA assures that link distances meet the IrDA Data 1.4 (low power) physical layer specification. The HSDL-3200 meets the link distance of 20 cm to other low power devices, and 30 cm to standard 1 meter IrDA devices.
VCC
R1 47
8 LEDA
LED DRIVER
TXD
7 TXD
RXD SHUT DOWN
6 RXD 5 SD
SHIELD
4 AGND
VCC C1 6.8 F
3 2 C2 100 nF
VCC CX
1 GND
8 7 6 5 4 3 2 1
HSDL-3200-028 Pinout
8
7
6
5
4
3
2
1
I/O Pins Configuration Table Pin Description 1 Ground 2 Pin Bypass Capacitor 3 Supply Voltage 4 Analog Ground 5 Shut Down 6 Receiver Data Output 7 Transmitter Data Input 8 LED Anode
Symbol GND CX V CC AGND SD RXD TXD LEDA
Active
Note
High Low High
1
Note: 1. The shutdown pin (SD) must be driven either high or low. Do NOT float the pin.
Transceiver I/O Truth Table TXD High Low Low Don't Care Inputs Light Input to Receiver Don't Care High Low Don't Care Outputs SD Low Low Low High LED On Off Off Off RXD Not Valid Low High High Notes 2, 3
Notes: 2. In-Band IrDA signals and data rates 115.2 Kb/s. 3. RXD Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident intensity.
Ordering Information The ordering information is as shown in the table below. There are two options available. Front Option #021 Taped and 13" Reel packaging, 2500 per reel Top Option -028 Taped and 13" Reel Packaging, 2500 per reel
Recommended Application Circuit Components Component Recommended Value R1 47 , 1%, 0.125 Watt C1 6.8 F, 20%, Tantalum C2 100 nF, 20%, X7R Ceramic
Note 4
Note: 4. C1 must be placed within 0.7 cm of the HSDL-3200 to obtain optimum noise immunity.
Caution: The BiCMOS inherent to this design of this component increases the component's susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
2
Absolute Maximum Ratings For implementations where case to ambient thermal resistance 50C/W. Parameter Symbol Min. Max. Storage Temperature TS -40 100 Operating Temperature TA -25 85 DC LED Current I LED (DC) 20 Peak LED Current I LED (PK) 80 LED Anode Voltage Supply Voltage Input Voltage TXD, SD Output Voltage RXD V LEDA V CC VI VO -0.5 0 0 -0.5 7 7 V CC +0.5 V CC +0.5
Units C C mA mA V V V V
Conditions
90 s Pulse Width, 25% Duty Cycle
Recommended Operating Conditions Parameter Symbol Operating Temperature TA Supply Voltage V CC Logic High Voltage V IH TXD, SD Logic Low Voltage V IL TXD, SD Logic High Receiver EI H Input Irradiance Logic Low Receiver EI L Input Irradiance LED Current Pulse I LEDA Amplitude Receiver Signal Rate Ambient Light
Min. -25 2.7 2/3 VCC 0 0.0081
Max. 85 3.6 V CC 1/3 VCC 500 0.3
Units C V V V mW/cm 2 W/cm2 mA Kb/s
Conditions
Notes
For in-band signals. For in-band signals. Guaranteed at 25C
5 5
25 2.4
80 115.2
See "Test Methods" on page 12 for details
Note: 5. An in-band optical signal is a pulse/sequence where the peak wavelength, lp, is defined as 850 nm lp 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification.
3
Electrical and Optical Specifications Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25C and 3.0 V unless otherwise noted. Parameter Symbol Min. Typ. Max. Units Conditions Receiver RXD Logic Low VOL 0 0.4 V IOL = 200 A, For in-band EI Output Voltage Logic High VOH VCC VCC V IOH = -200 A, For in-band -0.2 EI 0.3 W/cm2 Viewing Angle 2f1/2 30 Peak Sensitivity Wavelength lp 880 nm RXD Pulse Width tpw 1.5 2.5 4.0 s RXD Rise and Fall Times tr, tf 25 100 ns tpw (EI) = 1.6 s, CL = 10 pF Receiver Latency Time tL 25 50 s Receiver Wake Up Time tW 50 100 s Transmitter Radiant Intensity EIH 4 8 28.8 mW/Sr ILEDA = 25 mA, TA = 25C, q1/2 15 Peak Wavelength lp 875 nm Spectral Line Half Width Dl1/2 35 nm Viewing Angle 2q1/2 30 60 Optical Pulse Width tpw 1.5 1.6 2 s tpw (TXD) = 1.6 s Optical Rise and Fall Times tr (EI) 600 ns tpw (TXD) = 1.6 s tf (EI) Maximum Optical tpw 20 50 s TXD pin stuck high Pulse Width (max) LED Anode On State VON 1.6 V ILEDA = 25 mA, Voltage (LEDA) VIH (TXD) = 2.7 V LED Anode Off State ILK 0.01 1.0 A VLEDA = VCC = 3.6 V, Leakage (LEDA) VI (TXD) 1/3 VCC Transceiver TXD and SD Logic Low IL -1 -0.01 1 A 0 VI 1/3 VCC Input Current Logic High IH 0.01 1 A VI 2/3 VCC Supply Current Shutdown ICC1 10 200 nA VCC = 3.6 V, VSD VCC -0.5 Idle ICC2 2.5 4 mA VCC = 3.6 V, VI (TXD) 1/3 VCC, EI = 0 Active ICC3 2.6 5 mA VCC = 3.6 V, Receiver VI (TXD) 1/3 VCC
Notes: 6. For in-band signals 115.2 Kb/s where 8.1 W/cm 2 EI 500 mW/cm2. 7. Wake up time is measured from SD pin high to low transition or VCC power on to valid RXD output. 8. Typical value is at EI = 10 mW/cm2. 9. Maximum value is at EI = 500 mW/cm2.
Note 6
6 6 7
8, 9
4
HDSL-3200#021 Package Dimensions
SOLDERING PATTERN MOUNTING CENTER 4 1.025 1.425 0.775 1.25 MOUNTING CENTER 1.35 C L EXTERNAL GROUND
1.75
0.6 RECEIVER 2.05 C L EMITTER 0.475 1.425 2.375 3.325 2.2 2.5 1.175
;;;; ;;;; ;; ;;;
2.85 1.05 1.25 2.55 4 8 3 2.9 1.85 UNIT: mm TOLERANCE: 0.2mm
0.35 0.65 0.80
C L
8
7
6
5
4
3
2
1
0.6
3.325 P0.95X7 = 6.65
1 GND 2 CX 3 VCC 4 AGND 5 SD 6 RXD 7 TXD 8 LEDA
HSDL-3200#021 Tape and Reel Dimensions
UNIT: mm
2.0 0.5 13.0 0.5 R1.0 A 21 0.8
; ;
B 2 0.5
TAPE DIMENSIONS 4 0.1 + 0.1 1.5 0 POLARITY PIN 8: LEDA 8.4 0.1 PIN 1: GND 3.4 0.1 0.4 0.05 2.8 0.1 8 0.1 PROGRESSIVE DIRECTION 1.75 0.1 1.5 0.1
7.5 0.1 16.0 0.2
EMPTY
PARTS MOUNTED
LABEL
(40 mm MIN.)
LEADER (400 mm MIN.) EMPTY (40 mm MIN.)
2 16.4 + 0
OPTION # 0S1 0L1
DIMENSION A ( 1 mm) 178 330
DIMENSION B ( 2 mm) 60 80
QUANTITY (POS/REEL) 500 2500
5
HSDL-3200-028 Package Outline
3.6 2 1.55 C L 1.55 2
+0.05 2.8 -0.2 +0.05 1.8 -0.2 C L
2.8 3.35
2.35
0.4 0.15
0.7 0.1
;; ;;;;
7.5
5.1
0.6 0.15 0 0.05 (MAX.) 3.325 0.95 x 7 = 6.65 0.15
0.95 0.1
0.3
UNIT: mm TOLERANCE: 0.2 mm COPLANARITY = 0.1 mm MAX.
6
HSDL-3200-028 Tape and Reel Dimensions
60TYP.
99.5 1 120 3 +0.5 13.1 -0
264 PS 330 1 1 2 DETAIL A (5/1)
+0.5 16.0 -0
D1
Po
P2
Do
B
E
F
;;;
A A Ao 5(MAX.) 5 3.1 0.1 A-A SECTION UNIT: mm SYMBOL SPEC SYMBOL SPEC Ao 3.65 0.10 E 1.75 0.10
P1
B
;; ;; ;;
T 5(MAX.) 2.6 W Bo 5 1.5 Ko T 0.40 0.10
Bo 7.90 0.10 F 7.50 0.10
Ko +0.05 2.75 - 0.10 Do 1.55 0.05
Po 4.00 0.10 D1 1.50 (MIN.)
P1 8.00 0.10 W
P2 2.00 0.10 10Po
16.00 0.30 40.00 0.20
NOTES: 1. 10 SPROKET HOLE PITCH CUMULATIVE TOLERANCE IS 0.2 mm. 2. CARRIER CAMBER SHALL NOT BE MORE THAN 1 mm PER 100 mm THROUGH A LENGTH OF 250 mm. 3. Ao AND Bo MEASURED ON A PLACE 0.3 mm ABOVE THE BOTTOM OF THE PACKET. 4. Ko MEASURED FROM A PLACE ON THE INSIDE BOTTOM OF THE POCKET TO TOP SURFACE OF CARRIER. 5. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED AS TRUE POSITION OF POCKET, NOT POCKET HOLE.
7
B-B SECTION
IR Transceiver Reflow Profile: Lead-free
255 230 220 200 180 160 120 80 25 0 P1 HEAT UP 50 100 150 R1
MAX. 260C R3 R4
T - TEMPERATURE - (C)
R2
60 sec. MAX. ABOVE 220C
R5
200
250 P4 COOL DOWN
300
t-TIME (SECONDS) P2 P3 SOLDER PASTE DRY SOLDER REFLOW
Process Zone Heat Up Solder Paste Dry Solder Reflow Cool Down
Symbol P1, R1 P2, R2 P3, R3 P3, R4 P4, R5
DT 25C to 160C 160C to 200C 200C to 255C (260C at 10 seconds max.) 255C to 200C 200C to 25C
Maximum DT/Dtime 4C/s 0.5C/s 4C/s -6C/s -6C/s
The reflow profile is a straightline representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates. The DT/Dtime rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-3200 castellation I/O pins are heated to a temperature of 160C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4C per second to allow for even heating of both the PC board and HSDL3200 castellation I/O pins.
Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200C (392F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255C (491F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic growth within the
solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200C (392 F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed 6C per second maximum. This limitation is necessary to allow the PC board and HSDL-3200 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL3200 transceiver.
8
Moisture Proof Packaging The HSDL-3200 is shipped in moisture proof packaging. Once opened, moisture absorption begins. Recommended Storage Conditions Storage Temperature 10C to 30C Relative Humidity Below 60%
Solder Pad, Mask and Metal Stencil
STENCIL APERTURE METAL STENCIL FOR SOLDER PASTE PRINTING
LAND PATTERN
SOLDER MASK
Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within 2 days if stored at the recommended storage conditions. If times longer than 2 days are needed, the parts must be stored in a dry box. Baking If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. In Reels In Bulk 60C, t 48 hours 100C, t 4 hours 125C, T 2 hours 150C, T 1 hour
PCB
HSDL-3200#021 Recommended Land Pattern (Front Option)
Tx LENS e Rx LENS
d b
SHIELD SOLDER PAD g
DIMENSION a b mm 1.75 0.60 0.95 1.25 2.70 2.20 2.28 INCHES 0.069 0.024 0.037 0.049 0.106 0.087 0.089
Y
f
c (PITCH) d e
a theta c
X
f g
Baking should only be done once.
FIDUCIAL
8x PAD
FIDUCIAL
;;;; ;; ;;;;; ;;;;;; ;;;; ;;;; ;;
2.20 1.45 0.9 1.275 MOUNTING CENTER 1.60 0.60 PITCH 7 x 0.95 3.625
HSDL-3200-028 Recommended Land Pattern (Top Options)
0.575
9
Recommended Metal Solder Stencil Aperture It is recommended that only 0.127 mm (0.005 inches) or 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used: w, the width of aperture is fixed at 0.55 mm (0.022 inches). Aperture opening for shield pad is as per land pattern. Adjacent Land Keepout and Solder Mask Areas Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. "h" is the minimum solder resist strip width required to avoid solder bridging adjacent pads. It is recommended that two fiducial crosses be placed at mid-length of the pads for unit alignment. Note: Wet/Liquid PhotoImageable solder resist/mask is recommended.
APERTURES AS PER LAND DIMENSIONS
t
w l
t, nominal stencil thickness mm inches 0.127 0.005 0.11 0.004
l, length of aperture mm inches 1.75 0.05 0.102 0.002 2.4 0.05 0.118 0.002
k
h Y j
X m
DIMENSION h k j m
mm MIN. 0.2 8.2 2.6 3.0
INCHES MIN. 0.008 0.323 0.102 0.118
Recommended Solder Paste/Cream Volume for Castellation Joints Based on calculation and experiment, the printed solder paste volume required per castellation pad is 0.22 cubic mm (based on either no-clean or aqueous solder cream types with typically 60% to 65% solid content by volume). Using the recommended stencil will result in this volume of solder paste.
10
Pick and Place Misalignment Tolerance and Self-Alignment after Solder Reflow If the printed solder paste volume is adequate, the HSDL3200 will self-align after solder reflow. Units should be properly reflowed in IR/Hot Air convection oven using the recommended reflow profile. The direction of board travel does not matter. Allowable Misalignment Direction Tolerance x 0.2 mm (0.008 inches) Theta 3 degrees
Tolerance for Rotational (Theta) Misalignment Units when mounted should not be rotated more than 3 degrees with reference to center X-Y as shown in the recommended land pattern. Units with rotational misalignment of more than 3 degrees will not completely self-align after reflow. Units with less than a 3 degree misalignment will self-align after solder reflow. Y-Axis Misalignment of Castellation In the Y direction, the HSDL-3200 does not self-align after solder reflow. It is recommended that it be placed in line with the fiducial mark (mid-length of land pad). This will enable sufficient land length (minimum of 1/2 land length) to form a good joint. See the drawing below.
Marking Information The unit is marked with a letter "B" and "YWWLL" for front options on the shield. Y is the year, WW is the workweek, and LL is the Lot information.
Tolerance for X-Axis Alignment of Castellation Misalignment of castellation to the land pad should not exceed 0.2 mm (0.008 in.), or about one half the width of the castellation during placement of the unit. The castellations will self-align to the pads during solder reflow.
LENS EDGE
MINIMUM 1/2 THE LENGTH OF THE LAND PAD FIDUCIAL
11
Window Design To insure IrDA compliance, there are some constraints on the height and width of the optical window. The minimum dimensions ensure that the IrDA cone angles are met, and there is no vignetting, and the maximum dimensions ensure that the effects of stray light are minimized. The minimum size corresponds to a cone angle of 30 degrees, the maximum to a cone angle of 60 degrees.
;; ; ;;;; ;;;;
Z X
The drawing below shows the module positioned in front of a window.
Minimum and Maximum Window Sizes Dimensions are in mm. Depth (Z) Y Min. X Min. 0 1.70 6.80 1 2.23 7.33 2 2.77 7.87 3 3.31 8.41 4 3.84 8.94 5 4.38 9.48 6 4.91 10.01 7 5.45 10.55 8 5.99 11.09 9 6.52 11.62 10 7.06 12.16
Y Max. 3.66 4.82 5.97 7.12 8.28 9.43 10.59 11.74 12.90 14.05 15.21
X Max. 8.76 9.92 11.07 12.22 13.38 14.53 15.69 16.84 18.00 19.15 20.31
Window Height Y vs. Module Depth Z
16 14
WINDOW HEIGHT Y - mm
12 10 8 6 4 2 0 0 2 4 6 8 10 ACCEPTABLE RANGE
Y
X is the width of the window, Y is the height of the window, and Z is the distance from the HSDL-3200 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens is 5.1 mm. The equations that determine the size of the window are as follows: X = 5.1 + 2(Z + D) tan q Y = 2(Z + D) tan q Where q is the required half angle for viewing. For the IrDA minimum, it is 15 degrees, for the IrDA maximum it is 30 degrees. (D is the depth of the LED image inside the part, 3.17 mm.) These equations result in the following tables and graphs: 12
MODULE DEPTH Z - mm
Window Width X vs. Module Depth Z
22 20
WINDOW WIDTH X - mm
18 16 14 12 10 8 6 0 2 4 6 8 10 ACCEPTABLE RANGE
MODULE DEPTH Z - mm
Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be curved for mechanical design reasons, place a curve on the back side of the window that has the same radius as the front side. While this will not completely eliminate the lens effect of the front curved surface, it will reduce the effects. The amount of change in the radiation pattern is dependent upon the material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. Once these items are known, a lens design can be made which will eliminate the effect of the front surface curve.
Flat Window
Curved Front and Back
Curved Front, Flat Back The following drawings show the effects of a curved window on the radiation pattern. In all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm.
13
Test Methods Background Light and Electromagnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 3 V/m maximum (please refer to IEC 801-3, severity level 3 for details). 2. Sunlight: 10 kilolux maximum at the optical port. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased to provide 490 W/cm2 (with no modulation) at the optical port. The light source faces the optical port.
This simulates sunlight within the IrDA spectral range. The effect of longer wavelength radiation is covered by the incandescent condition. 3. Incandescent Lighting: 1000 lux maximum. This is produced with general service, tungsten-filament, gas-filled, inside frosted lamps in the 60 Watt to 100 Watt range to generate 1000 lux over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The source is expected to have a filament temperature in the 2700 to 3050 Kelvin range and a spectral peak in the 850 to 1050 nm range. 4. Fluorescent Lighting: 1000 lux maximum. This is simulated with an IR source
having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased and modulated to provide an optical square wave signal (0 W/cm2 minimum and 0.3 W/cm2 peak amplitude with 10% to 90% rise and fall times less than or equal to 100 ns) over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The frequency of the optical signal is swept over the frequency range from 20 kHz to 200 kHz. Due to the variety of fluorescent lamps and the range of IR emissions, this condition is not expected to cover all circumstances. It will provide a common floor for IrDA operation.
www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2005 Agilent Technologies, Inc. Obsoletes: 5989-0243EN May 3, 2005 5989-3019EN

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